Sanghvi Electronics

The SKIIP22NAB12T3x family are Semikron MiniSKiiP® 2 IGBT power modules configured as CIB (Converter–Inverter–Brake) intelligent power modules suitable for medium‑power AC–DC–AC drive systems, motor drives, inverters, and power converters.
This module class integrates key power stages into a compact, board‑mountable package optimized for reliability, ease of assembly, and efficient thermal performance.

Core Electrical Ratings (Typical)

We extrapolate typical values from the SKIIP22NAB12T-series family where specific SKIIP22NAB12T35 datasheet is not published online.

• Voltage class: ~1200 V (collector–emitter maximum)
• Nominal current: ~35 A class (module rating)
• Pulsed current capability: higher, depending on duty and cooling
• Gate‑emitter voltage: ±15–±20 V typical
• Integrated topology: 3‑phase Rectifier + Brake Chopper + 3‑phase Inverter (CIB)

 This makes it appropriate for medium‑power industrial applications like variable‑frequency drives, renewable inverters, UPS systems, and HV power supplies.

Module Topology & Integrated Functions

The module includes:

• 3‑phase diode rectifier (converter) to convert AC mains to DC link.
• Brake (boost) chopper switch to control/regulate DC‑link voltage under regenerative conditions.
• 3‑phase IGBT inverter bridge (six‑pack) for PWM‑controlled AC output.
• Anti‑parallel freewheeling diodes for current continuity during switching.
• NTC thermistor for integrated temperature monitoring (typical in MiniSKiiP modules).

The SKIIP12AC12T4V1 is a MiniSKiiP® 1 IGBT power module manufactured by Semikron Danfoss. It is designed as a 3-phase inverter (six-pack IGBT module), primarily used for DC–AC power conversion in motor drives and inverter systems.

Unlike NAB-type modules, this is inverter-only (AC configuration) — it does not include rectifier or brake chopper stages.

Electrical Characteristics:

• Collector-emitter voltage (VCES): 1200 V
• Typical current range: ~10–15 A class (device family level)
• Gate-emitter voltage (VGES): ±20 V

Suitable for medium power inverter applications (~5.5 kW motor range).

Internal Topology 3-Phase Inverter (Six-Pack Configuration)

The module contains:

• 6 × IGBTs (three half-bridges)
• 6 × anti-parallel freewheeling diodes

Structure:

• U, V, W phase outputs
• DC+ and DC− terminals
• Each phase = one half-bridge

This configuration enables:

• DC → 3-phase AC conversion
• PWM motor control

The SKIIP23NAB126V10 is a highly integrated intelligent IGBT power module designed for medium‑power AC–DC–AC drive systems. It combines multiple converter stages into a compact MiniSKiiP® 2 package and is commonly used in industrial motor drives, variable frequency drives (VFDs), inverters, UPS systems, and photovoltaic power conversion.

• Product family: MiniSKiiP® 2
• Technology: IGBT (Trench) + diodes
• Topology: CIB — Converter (rectifier) + Brake chopper + Inverter
• Voltage class: 1200 V
• Nominal current: ~25 A
• Typical inverter output: up to ~14 kVA (~7.5 kW motor)

⚙️ Electrical Characteristics �� Semiconductor Ratings

• Collector–Emitter Voltage (V_CES): 1200 V maximum (IGBT and diodes)
• Nominal continuous current: ~25 A †
• Pulsed collector current (ICRM): ~50 A (short pulses, dependent on thermal conditions)
• Gate‑Emitter Voltage (V_GES): typically ±20 V (standard for IGBT gates)
• Topology functions:
  • 3‑phase bridge rectifier (diode network)
  • Brake (boost) chopper switch
  • 3‑phase IGBT inverter bridge

Integrated Functional Blocks

The module integrates these core stages internally to simplify system design:

1. 3‑phase Input Rectifier (Converter)
   • Converts three‑phase AC mains to DC bus voltage.
2. Brake Chopper Circuit
   • Regulates DC link voltage by switching excess energy to a brake resistor during regenerative conditions.
3. 3‑Phase Inverter Bridge (Six‑Pack)
   • Six IGBTs arranged into three half‑bridges generate controllable AC output via PWM.
4. Freewheeling Diodes
   • Anti‑parallel diodes provide current continuity during IGBT switching.
5. NTC Temperature Sensor
   • Built‑in thermistor for thermal monitoring and protection in the drive control system.

This integrated CIB topology enables the module to act as a complete AC–DC–AC converter stage, reducing external components and board complexity.

Semiconductor & Package Technology

• IGBT 3 (Trench) chips: High‑efficiency IGBT transistors with low conduction and switching losses.
• CAL freewheeling diodes: Soft recovery diodes matched to IGBTs for reduced switching stress.
• MiniSKiiP® 2 housing: Compact press‑fit power pins with reliable spring contacts improve mechanical and thermal reliability.
• UL recognized: Module has safety recognition (e.g., UL E63532).

Thermal & Mechanical Features

• Dimensions: ~59 × 52 × 16 mm (MiniSKiiP® 2 form factor)
• Weight: ~0.055 kg gross / ~0.06 kg with packaging depending on variant.
• Heat dissipation: Designed for attachment to a heatsink with screw mounting.
• Variants: Different lid and thermal paste configurations (e.g., standard lid, slim lid, thermal paste applied) for optimized thermal performance.

Applications

• Three‑phase motor drives and VFDs
• AC inverters for industrial loads
• UPS power stages
• Photovoltaic / renewable energy converters
• General AC–DC–AC power conversion systems